Formulated for electrical potting and encapsulation applications, Company's EP36AO combines high thermal conductivity with thermal stability. This flexible, heat-resistant epoxy has superior mechanical properties. Serviceable over the temperature range of -80°F to +500°F, the product provides high performance in harsh conditions. Once cured, it features solid electrical characteristics including a dielectric strength of 400 vols/mil, a volume resistivity of 2-3 x 10¹² ohm-cm and thermal conductivity of 9-10 BTU·in/ft²·hr·°F at 25°C. This system has a coefficient of thermal expansion exceeding 75 in/in x 10^-6/°C at 60°C and a tensile strength of over 2,000 psi. The product is a capable adhesive and coating that adheres well to both metallic and non-metallic substrates, and it features long-term chemical resistance to an array of organic and inorganic chemicals.

Master Bond, www.masterbond.com